XIAMEN INNOVACERA ADVANCED MATERIALS CO., LTD - Research, development, design, sale and service of ceramic components

Hot pressing(HP) sintering process is the most commonly used technique for fabricating dense, non-oxide monolithic ceramics and their composites. During hot pressing sintering, temperature and pressure are simultaneously applied to the powder compact contained in a die. Under the application of pressure, the contact points between particles develop a very high stress, increasing the local diffusion rates. As for all forms of densification, the particle size, temperature, pressure, heating rate and holding time all influence the density and micro-structure of the hot pressed compacts whilst a controlled atmosphere is required for the Non-oxides. Carbides, borides and silicides are often hot pressed under vacuum or an inert gas such as argon whilst the nitrides are generally densified under a nitrogen atmosphere.

Alumina Ceramic Thermal Pads are designed to provide a preferential heat-transfer path between heat-generating components, power switches, heat sinks, and other cooling devices. Alumina ceramic (Al₂O₃) thermal pads are renowned for their exceptional thermal conductivity and electrical insulation properties. Alumina ceramics exhibits thermal conductivity ranging from 20 to 30 W/m·K, allowing for efficient heat dissipation in high-power applications. This critical feature prevents overheating, enhancing the reliability and longevity of electronic components. Additionally, alumina’s high melting point and chemical stability make it suitable for harsh environments, ensuring these thermal pads maintain performance even under extreme conditions.

Innovacera standard aluminum nitride wafer diameters are from 50.8 mm (2 inch) to 200 mm (8 inch) ; mostly use are 6” aluminum nitride wafers and 8” AlN wafer substrates . AlN Wafers can be produced in various thicknesses from 0.125mm to 1mm with polished or lapped sides, customized sizes or request are also available. Aluminum Nitride (AIN) materials play a important roles in the semiconductor industry, the similarities between its thermal profile and that of silicon has made an ideal choice for wafer-related semiconductor applications. Innovacera’s Aluminum nitride wafers have high reliability of Si chip and thermal heat cycling. According to direct wafer bonding technology, polished semiconductor wafers can be bonded together without adhesives. Direct wafer bonding requires very flat and high smooth surface (Ra≤0.05um), Innovacera AlN wafers substrate can meet this requirements.

As an advanced semiconductor manufacturing equipment, ion implanters have very high requirements for the performance of materials. As an important component, ceramic accessories play a vital role in ion implanters. A.Basic characteristics of ion implanter accessories and ceramic accessories Ion implanter accessories are mainly made of high-purity silicon nitride, silicon carbide (SiC), alumina, alumina/silicon carbide microporous ceramics, aluminum nitride (AIN), sapphire and other ceramic materials, with the following characteristics: 1. High hardness and high strength: Ceramic fittings have high hardness and strength, which can withstand high load and wear during ion implantation. 2. High thermal stability: Ceramic fittings have a high melting point and can maintain stable performance in high temperature environments. 3. Good chemical stability: Ceramic accessories have good chemical stability and can work stably for a long time in harsh environments.

Alumina ceramic heater is a kind of high efficiency heat division uniform heater, excellent thermal conductivity of metal alloy, to ensure that the hot surface temperature uniform, eliminate the hot and cold points of the equipment. Alumina ceramic heater is divided into two kinds, respectively PTC ceramic heating body and MCH ceramic heating body. The materials used in these two products are completely different, but the finished products are similar to ceramics, so they are collectively referred to as “ceramic heating elements”.Due to the increasingly high operating temperature requirements in modern industry, ceramic heaters can adapt to, especially chemical fiber, engineering plastics, plastic machinery, electronics, medicine, food and various pipeline heating;

Sealing refers to the physical or chemical connection of two or more materials. Joining technology is one of the key technologies in glass and ceramic manufacturing, which can improve the product’s sealing, thermal resistance, and stability, thereby improving its reliability and service life. The connection methods between ceramics and metals include mechanical connection, adhesive connection, brazing connection, solid-phase diffusion connection, instant liquid phase connection, melting welding, self-propagating high-temperature synthesis connection, friction welding, microwave connection, and ultrasonic connection, etc. According to the connection method, it can be divided into mechanical sealing and welding sealing. Mechanical sealing mainly realizes through fasteners, sealing rings, etc., while welding sealing realizes through melting connection.

Powder metallurgy has core process advantages such as high material utilization, low unit energy consumption, and environmental protection. It is a technology that is in line with the future direction of carbon neutrality. In recent years, with the maturity of powder metallurgy technology and the trend of miniaturization of parts, two emerging process routes, metal injection molding (MIM) and 3D printing (AM), have rapidly emerged. At the same time, the supply of high-quality powder raw materials has begun to become a major factor restricting the development of the industry. Small and complex parts are undoubtedly more suitable for injection molding and 3D printing (particle size of 20μm or even smaller), and have been increasingly used in high-end fields such as aerospace, medical, electronics, and military industry.

Innovacera Ceramic Thermally Conductive Interface Pads are designed to provide a preferential heat-transfer path between heat-generating components, heat sinks, and other cooling devices. The pads are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact. The pads are made by ceramic material such as alumina ceramic and aluminum nitride, which help in providing enhanced thermal conductivity and excellent insulation performance. Aluminum Nitride Ceramic Thermal Pads Regular Size: For Package Type: TO-3P/TO-220/TO-247/TO-264/TO-3/TO-254/TO-257/TO-258, With Hole or Without Hole. TO-3P 25x20x1mm (other thickness is available, too); TO-220 20x14x1mm (other thickness is available, too); TO-247 22x17x0.635mm (other thickness is available, too); TO-264 28x22x1mm (other thickness is available, too); TO-3 39.7×26.67x1mm (Rhombus shape); TO-254 34x24x1mm (other thickness is available, too); ....

In the dynamic world of the copper wire industry, efficiency and quality are key factors in staying ahead. We understand the importance of equipping your industrial cable drawing machines with the best components. That’s why we’re excited to launch our innovative range of drawing rings made from zirconia ceramic, specifically designed to improve the performance of your cable drawing process. What are drawing rings? Why are they essential? Wire drawing rings are a key component in the industrial cable drawing process. The rings guide the cable through the machine, apply tension and gradually reduce its diameter. This results in thinner, stronger cables that are ideal for various industrial and electrical applications. So a good choice of drawing rings can make a difference in both the quality of the end product and the efficiency of the process.

Boron Nitride is often referred to as “white graphite” since it has similar layer structure as graphite. They have excellent high temperature resistance properties, including high dielectric strength, thermal conductivity and excellent chemical inertness, which can solve the challenges of some of the most demanding application fields.